Stencil Printer with Fully Integrated 3D SPI from Kurtz Ersa Inc. – Learn More at the SMTA Upper Midwest Expo


Minneapolis, MN, 06/14/2018
Ersa VERSAPRINT 2.0 Ultra with 3D inspection
Ersa VERSAPRINT 2.0 Ultra with 3D inspection
Eras HOTFLOW 3/20 reflow soldering system
Ersa Hybrid Rework System HR 550
Ersa SMARTFLOW 2020 - selective soldering technology at smallest footprint
  
 

Go to product pages:

Ersa HOTFLOW 3/20

Ersa SMARTFLOW 2020

Ersa Hybrid Rework System HR 550

Ersa VERSAPRINT 2 Ultra

Stencil Printer with Fully Integrated 3D SPI from Kurtz Ersa Inc. – Learn More at the SMTA Upper Midwest Expo

Plymouth, WI — June 2018 — Kurtz Ersa Inc., a leading supplier of electronics production equipment, today announced that plans to exhibit at the Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 14, 2018 at the DoubleTree by Hilton Minneapolis - Park Place in Minneapolis, MN. The Ersa team will highlight its advanced reflow, selective solder and rework equipment, including its VERSAPRINT 2 Ultra stencil printer, Ersa HOTFLOW 3/20, SMARTFLOW 2020 and HR 550.

 

The VERSAPRINT 2 Ultra is the first stencil printer worldwide with fully integrated 100 percent 3D SPI. Advantages vs. 3D SPI standalone systems include:

  • 3D SPI for the inspection of complex PCBs directly after the printing process
  • VERSAPRINT stencil inspection detects errors before they appear
  • Zero reference measurement of the unprinted PCB can be performed before every print
  • Integrated closed-loop function for print offset compensation
  • One software platform for print inspection – one consistent operator concept
  • Maintenance and service for only one machine
  • One contact for both processes
  • Less space required on the shop floor

 

With the Ersa HOTFLOW 3/20, ten heated zones  top-and-bottom and  four active cooling zones, Ersa presents a process efficient solution, which is characterized by its high throughput inline operation,  low operating cost and very  attractive price.

 

Ersa offers a range of selective solder systems, starting with the SMARTFLOW 2020. Due to its universal pallet fastening, the SMARTFLOW can handle PCB sizes of up to 508 x 508 mm [20” x 20”].  The SMARTFLOW 2020 is smart and compact without compromising quality.

 

The HR 550 hybrid rework system features a 1,500W high performance hybrid heating element to desolder and solder SMT components up to 70 x 70 mm. A 2,400 W infrared bottom heater in three heating zones guarantees homogeneous bottom-side preheating of the complete assembly. The system addresses all users with the highest requirements in terms of precision and process safety in electronic assembly rework applications.

 

Locations:


DoubleTree by hilton Minneapolis - Park Place (Thursday, June 14, 2018)

Park Ballroom

1500 Park Place Blvd.

Minneapolis, MN 55416