Ersa presents brand new products at SMT Hybrid Packaging 2016

GERMANY – March 2016: Ersa GmbH, the largest supplier of soldering equipment, is pleased to announce they will exhibit a wide range of industry leading technologies in Hall 7, Booth 117 at the upcoming SMT Hybrid Packaging show, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany. Furthermore, they will exhibit for the first time the VERSAFLOW 3/45 with VERSASCAN and VERSAEYE.

The VERSAFLOW 3/45 is the first in-line selective soldering machine with dual track transport. Highest flexibility and highest throughput can be realised with the smallest possible required space. Already an industry favorite, the 3/45 is now equipped with VERSASCAN and VERSAEYE. The VERSASCAN module recognizes multicodes on printed boards, product carriers or printed boards that are not fully or wrong assembled. These “bad boards” will be excluded from the processing. This saves resources and cycle time and leads to a clearly increased productivity. The VERSAEYE gives information about the solder joint: good or bad. The VERSAEYE is system optimized for wave and selective soldering systems, is compatible with work piece carriers, and makes modular inspection possible: bottom, top or bottom and top. VERSAEYE is also available with up to nine cameras per module.

Also on display at the show, Ersa’s new VERSAFLOW 4/55: the ideal selective soldering system for large and complex board assemblies in electronic manufacturing. Because of its modular design and depending on the demands additional flux, preheat and solder modules can be integrated. All modules run autonomously through their configured programs. Set-up times and operator interventions are not required, so the system can always operate at the highest level of productivity and process flexibility.  

Stop by at Ersa’s booth to see the Ersa HOTFLOW 3/20 VOIDLESS, Ersa presents a process efficient solution to minimize the occurrence of voids, which is characterized by its high throughput in inline operation, short process times and low operating costs. The VOIDLESS module, for which no additional maintenance is required, can be activated/deactivated at any time and reduces the occurrence of voids when compared to other soldering processes by up to 98 percent.

The Ersa stencil printer VERSAPRINT S1-3D combines precise stencil printing and 100 percent 3D-SPI in one system – featuring the smallest footprint. The VERSAPRINT stencil printers with integrated 100 percent post-print inspection have successfully established themselves in today’s market for electronic manufacturing equipment. Extending 2D inspection, Ersa now presents the VERSAPRINT 3D-SPI – with even more process control and still minimal floor space requirements.

The powerful Hybrid Rework System HR 550 provides high performance rework for professionals.  Highly efficient with a 1,500 W hybrid heating head, the large-area IR bottom has heating in three zones, and the HR 550 boasts an integrated vacuum pipette for component removal and placement. Highly accurate placement with integrated force sensor and computer aided component adjustment make this a powerful rework system. Finally, the i-TOOL HIGH POWER with 250 W will be on display in Ersa’s booth. With the i-TOOL HIGH POWER Ersa has developed an extremly powerful 250 W soldering iron that can be operated with the successful Ersa multi-channel soldering and desoldering stations i-CON VARIO 2 and 4. Meanwhile the operator can all in all use ten different tools for soldering and desoldering for this stations.