Repair of electronic assemblies with Infrared and Hybrid Rework Systems
For over 20 years now, thousands of users worldwide benefit from Ersa´s patented IR- and Hybrid-Rework technology. In addition to their outstanding cost/price ratio, Ersa systems have established their position in the market because they continue to deliver the best results even for the most challenging SMT / BGA rework applications. From smallest chip components (01005) up to the largest BGA, Ersa Rework Systems allow sucessful touch-up with the first process.
General and independent hints are provided by the ZVEI guideline Rework of Electronic Assemblies.
Downloads for discontinued products can be found here.