Award winning and patented BGA inspection systems
For more than 20 years thousands of users worldwide have benefited the possibility to inspect hidden solder joints in a non destructive way. Whether for inspection under Ball Grid Arrays (BGA) or for inspection where other microscopes are stretched to their limits: ERSASCOPE technology offers significant added value to any Quality Assurance program.
Convince yourself of the many advantages of the ERSASCOPE inspection systems!
Downloads for discontinued products can be found here.