Award-Winning Reflow, Selective Solder & Rework from Ersa at SMTA Intermountain Expo
Boise, ID 83725, 03/20/2018
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Kurtz Ersa North America, a leading supplier of electronics production equipment, today announced plans to exhibit at the SMTA Intermountain (Boise) Expo & Tech Forum, scheduled to take place Tuesday, March 20, 2018 at Boise State University in Boise, ID. The Ersa team will highlight its advanced reflow, selective solder and rework equipment.
With the Ersa HOTFLOW 3/20, ten heated zones top-and-bottom and four active cooling zones, Ersa presents a process efficient solution, which is characterized by its high throughput inline operation, low operating cost and very attractive price.
Ersa offers a range of selective solder systems, starting with the SMARTFLOW 2020. Due to its universal pallet fastening, the SMARTFLOW can handle PCB sizes of up to 508 x 508 mm [20” x 20”]. The SMARTFLOW 2020 is smart and compact without compromising quality.
The HR 550 hybrid rework system features a 1,500W high performance hybrid heating element to desolder and solder SMT components up to 70 x 70 mm. A 2,400 W infrared bottom heater in three heating zones guarantees homogeneous bottom-side preheating of the complete assembly. The system addresses all users with the highest requirements in terms of precision and process safety in electronic assembly rework applications.
For more information about Kurtz Ersa North America, visit www.ersa.com.
Location:
Boise State University
Student Union Building - Jordan D Ballroom
1910 University Drive
Boise, ID 83725